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Friday, 15 November 2019

Graphical simulation of baking bread

TeranGroup presents a "novel thermomechanical model" for simulating rising dough and the properties of bread, cookies, pancakes, etc.

Heat transfer with thermal expansion is used to model thermal variations in material properties. Water- based mass transfer is resolved through the porous mixture, gas represents carbon dioxide produced by leavening agents in the baking process and dough is modeled as a viscoelastoplastic solid to represent its varied and complex rheological properties. Water content in the mixture reduces during the baking process according to Fick’s Law which contributes to drying and cracking of crust at the material boundary. Carbon dioxide gas produced by leavening agents during baking creates internal pressure that causes rising. The viscoelastoplastic model for the dough is temperature dependent and is used to model melting and solidification. We discretize the governing equations using a novel Material Point Method designed to track the solid phase of the mixture.

Can't wait for the next generation of sadistically realistic sandbox survival simulators. [via Dean Putney]



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